Secondary copper removal process for treating low concentration integrated wastewater in PCB electro
Secondary copper removal process for treating low concentration integrated wastewater in PCB electroplating
Patent No.: ZL201510321718.5
Application date: 2015.06.12
Announcement (announcement) date: 2015.09.30
Main technical features:
ü The treatment process includes a secondary copper removal process: the first stage removes copper from the hydrated copper ions in the wastewater, and the second stage removes the copper ions from the second stage.
ü After the wastewater is upgraded, enter the pH adjustment tank, add the alkaline agent by pumping to control the pH to 8.5~9, enter the fast mixing tank and slow mixing tank, and the clear water after the first stage sedimentation is pumped into the broken pool, plus The appropriate amount of ferrous sulfate is broken, and the pH of the wastewater is adjusted to 8 ~ 9, too fast mixing tank, slow mixing tank, secondary sedimentation wastewater enters the pH recovery tank for biochemical treatment, up to standard discharge
ü Conducive to eliminating the impact of fluctuations in the drainage of the workshop on the stability of wastewater treatment, and increasing the means of regulating wastewater
ü Save the cost of chemical treatment, reduce the amount of system sludge, and increase the copper content of sludge, which is conducive to resource recovery, stable drainage water quality, and reduced wastewater treatment cost. It has significant promotion value in wastewater treatment of existing PCB industry.
First level: integrated wastewater → pH adjustment tank → fast mixing tank → slow mixing tank → primary sedimentation tank
Second stage: first stage sedimentation tank→breaking pool→pH adjustment tank→fast mixing tank→slow mixing tank→secondary sedimentation tank→pH recovery tank→biochemical treatment/emission